Polyimide film used for insulating circuit boards, high temperature powder coating and transformers manufacturing

Polyimide film used for insulating circuit boards, high temperature powder coating and transformers manufacturing
  • Polyimide-film
  • Polyimide films
  • die cut Polyimide film
  • Polyimide film die cut

Short Description:

Product Description Polyimide (PI) is a polymer of imide monomers, aslo know as heat resistant film or high temperature film. With their high heat-resistance, polyimide enjoys diverse applications in roles demanding rugged organic materials. Polyimide film is ideal for insulating circuit boards, high temperature powder coating and transformers manufacturing. Polyimide film provides excellent electrical, thermal, physical and chemical properties over a wide temperature range between -269℃ (-45...


  • Sample: Free
  • Specifications: Custom sizes are available upon request.
  • Product Detail

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    Product Description

    Polyimide (PI) is a polymer of imide monomers, aslo know as heat resistant film or high temperature film. With their high heat-resistance, polyimide enjoys diverse applications in roles demanding rugged organic materials. Polyimide film is ideal for insulating circuit boards, high temperature powder coating and transformers manufacturing.

    Polyimide film provides excellent electrical, thermal, physical and chemical properties over a wide temperature range between -269℃ (-452℉) and 400℃ (752℉) making them superior for electrical insulation applications. Polyimide film can be laminated, metallized, punched, formed or adhesive coated. It is the recommended choice for applications that require an all-polyimide film with an excellent balance of properties over a wide range of temperatures.

     Kingzom can provide both standard and custom polyimide film solutions for a customer depending on their needs.

     Features

    • Temperature Resistance from -269℃ to over 400℃(452℉ to over 752℉)
    • Exceeds UL 94 V-0 flammability.
    • 235℃ (445℉ )  Relative Thermal Index (RTI).
    • Dimensionally stable (<0.08% shrink).
    • Isotropic (MD/TD Elongation 85%).
    • Scratch and abrasion resistant.
    • Excellent solvent resistance (MEK, Benzene, and Toulene).

     Applications

    • Mechanical parts
    • Electronic parts
    • Electrical Insulation
    • Pressure sensitive tape
    • Fiber optics cable
    • Insulation blankets
    • Insulation tubing
    • Automotive diaphragms sensors and manifolds
    • Etching
    • Shims

    Data Sheet

    Thickness125μm/5mil
    ColorAmber
    Density (kg/m³)1420±20
    Tensile Strength (MD/TD)≥135 Mpa/≥115 Mpa
    Elongation at Break (MD/TD)≥35%
    Surface Resistivity 200℃≥1.0*1013 Ω
    Frequency Electric Strength≥120MV/m
    Volume Resistivity 200℃≥1.0*1010 Ω.m
    Relative Inductivity 50HZ3.5±0.4
    Dielectric Loss Factor 50HZ≤4.0*10-3
    Shrinkage 150℃≤1.0%
    Working Temperature range-269℃ to + 400℃

    Physical Properties of Kingzom polyimide film at 23°C (73°F)

    Physical Properties of Kingzom polyimide film

    Workshops

    Kingzom polyimide film workshops

    Partners

    Kingzom polyimide film partners.

     

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