AI Technological know-how WPA Wafer Processing Movie and Spin Coating Adhesives Online video

Short-term wafer bonding for thin wafer processing is one of the important technologies of 3D program integration. AIT is happy to include to its wafer processing components answers with an revolutionary household of non permanent bonding film and spin coating answers for non permanent bonding of silicon system wafers to carrier wafers employing standard minimal temperature and minimal tension thermo-compression procedure.

AIT is the to start with identified to supply a film format of its higher temperature non permanent bonding adhesives for thin wafer processing. Leveraging its knowledge of film adhesive producing for semiconductor marketplace for the previous thirty+ years, wafer processing adhesive are out there from five micron to 80 micron for system wafers up to 450mm with and without the need of topography. AIT higher temperature capable wafer processing adhesives can all be removed with warmth-sliding and solvent assisted launch separation procedure with the adhesive on system and carrier wafers removed without the need of extra cleaning in most purposes. The WPA-TL 330 can also be removed with laser assisted procedure.

AIT non permanent bonding wafer processing adhesives are thermally stable to 3200-330°C and compatibility of the bonded compound wafers with typical WLP procedure tools and for bottom processing of 3DTSV wafers. Significant integrity in bond strength enables ease in back grinding to a thickness of 50 µm. Other system wafer processing this sort of as dry etching, damp etching, CMP, PVD, solvent primarily based spin coating of resists and polymers, lithography, electro plating and other elevated temperature processing up to 320-330°C for at the very least sixty minutes below higher vacuum are developed in the thermally and chemically stable novel polymers.

In addition to the to start with to make out there film formats of the higher temperature wafer processing adhesives, AIT WPA-TS 320 and WPA-TL 330 in comparison to standard and polyimide primarily based non permanent handling answers, also gives one of the maximum temperature and time of processing home windows for thin wafer processing as nicely as ease of removal and cleaning.