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UV release tape double sided easy to pick up for wafer back grinding (BG TAPE)/semiconductor polishing
Kingzom UV series tape including wafer cutting tape and glass cutting tape，could be produced upon your processing and requirements in our dust-free workshop. For example, the film and adhesive can be customized. Our UV cutting-tape materials outshines those expensive but single imported-ones. UV release tape double sided is designed for processing of wafer grinding, cutting, fine electronic components, also suitable for all kinds of processing or cutting of small parts. Its high adhesive eff...