High Temperature Masking Tape developed for wave solder masking of P.C. Board.

Intruduction:

This tape is developed for wave solder masking of P.C. Board

Features:

1.It has been laboratory tested on painted panels and found to remove cleanly at bake temperatures of up to 121 °C  for around an hour

2.Excellent transfer resistance to “difficult to remove from” surfaces like EDPM rubber moldings.

3.Tests indicate it is better than conventional masking tapes for sunllight resistance.

4.Custom sizes, shapes and rolls

Advantages:

1.High temperature performance

2.Slivering resistance after heating

3.No solder bath contamination

4.Excellent high temperature performance

5.No adhesive residue

6.No seepage of solder

7.Easy peel off after masking

Note: Custom sizes are available upon request and supply free sample for test.